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ADM1026JSTZ-R7 数据表(PDF) 29 Page - ON Semiconductor |
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ADM1026JSTZ-R7 数据表(HTML) 29 Page - ON Semiconductor |
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29 / 55 page ![]() ADM1026 http://onsemi.com 29 Note that the THERM pin is bidirectional, so THERM may be pulled low externally as an input. This causes the PWM and DAC outputs to go to full scale until THERM is returned high again. To disable THERM as an input, set Bit 0 of Configuration Register 3 (Reg. 07h). This configures Pin 42 as GPIO16 and prevents a low on Pin 42 from driving the fans at full speed. Figure 53. Assertion of INT Due to THERM Event THERM LIMIT THERM LIMIT - 55C THERM INT INT CLEARED BY STATUS REG 1 READ, BIT 2 OF CONFIG. REG. 1 SET, OR ARA TEMPERATURE Reset Input and Outputs The ADM1026 has two active low, power-on reset outputs, RESETMAIN and RESETSTBY. These operate as follows. RESETSTBY monitors 3.3 V STBY. At powerup, RESETSTBY is asserted (pulled low) until 180 ms after 3.3 V STBY rises above the reset threshold. RESETMAIN monitors 3.3 V MAIN. This means that at powerup, RESETMAIN is asserted (pulled low) until 180 ms after 3.3 V MAIN rises above the reset threshold. If 3.3 V MAIN rises with or before DVCC, RESETMAIN remains asserted until 180 ms after RESETSTBY is negated. RESETMAIN can also function as a RESET input. Pulling this pin low resets the registers, which are initialized to their default values by a software reset. (See the Software Reset Function section for register details). Note that the 3.3 V STBY pin supplies power to the ADM1026. In applications that do not require monitoring of a 3.3 V STBY and 3.3 V MAIN supply, these two pins should be connected together (3.3 V MAIN should not be left floating). To ensure that the 3.3 V STBY pin does not become back driven, the 3.3 V STBY supply should power on before all other voltages in the system. See Table 5 for more information about pin configuration. Figure 54. Operation of Offset Outputs RESETSTBY RESETMAIN 3.3VMAIN ~1.0 V 180ms POWER−ON RESET 180ms 3.3VSTBY ~1.0 V NAND Tree Tests A NAND tree is provided in the ADM1026 for automated test equipment (ATE) board-level connectivity testing. This allows the functionality of all digital inputs to be tested in a simple manner and any pins that are nonfunctional or shorted together to be identified. The structure of the NAND tree is shown in Figure 55. The device is placed into NAND tree test mode by powering up with Pin 25 held high. This pin is sampled automatically after powerup, and if it is connected high, then the NAND test mode is invoked. Figure 55. NAND Tree NTESTOUT GPIO8 FAN0 FAN1 FAN2 FAN3 FAN4 FAN5 FAN6 CI SDA SCL FAN7 INT GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 The NAND tree test may be carried out in one of two ways. 1. Start with all inputs low and take them high in turn, starting with the input nearest to NTEST_OUT (GPIO16/ THERM) and working back up the tree to the input furthest from NTESTOUT (INT). This should give the characteristic output pattern shown in Figure 56, with NTESTOUT toggling each time an input is taken high. 2. Start with all inputs high and take them low in turn, starting with the input furthest from NTEST_OUT (INT) and working down the tree to the input nearest to NTEST_OUT (GPIO16/THERM). This should give a similar output pattern to Figure 57. |
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