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数据搜索系统，热门电子元器件搜索 |
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PIC16F72/ML 数据表(PDF) 122 Page - Microchip Technology |
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PIC16F72/ML 数据表(HTML) 122 Page - Microchip Technology |
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122 / 136 page  PIC16F72 DS39597B-page 120 2002 Microchip Technology Inc. 28-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP) * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-150 Drawing No. C04-073 10 5 0 10 5 0 Mold Draft Angle Bottom 10 5 0 10 5 0 α Mold Draft Angle Top 0.38 0.32 0.25 .015 .013 .010 B Lead Width 203.20 101.60 0.00 8 4 0 φ Foot Angle 0.25 0.18 0.10 .010 .007 .004 c Lead Thickness 0.94 0.75 0.56 .037 .030 .022 L Foot Length 10.34 10.20 10.06 .407 .402 .396 D Overall Length 5.38 5.25 5.11 .212 .207 .201 E1 Molded Package Width 8.10 7.85 7.59 .319 .309 .299 E Overall Width 0.25 0.15 0.05 .010 .006 .002 A1 Standoff § 1.83 1.73 1.63 .072 .068 .064 A2 Molded Package Thickness 1.98 1.85 1.73 .078 .073 .068 A Overall Height 0.65 .026 p Pitch 28 28 n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS* INCHES Units 2 1 D p n B E1 E L β c φ α A2 A1 A β § Significant Characteristic |
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