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PIC16F72/ML 数据表(PDF) 123 Page - Microchip Technology

部件名 PIC16F72/ML
功能描述  28-Pin, 8-Bit CMOS FLASH MCU with A/D Converter
PDF  136 Pages
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制造商  MICROCHIP [Microchip Technology]
网页  http://www.microchip.com
标志 MICROCHIP - Microchip Technology

PIC16F72/ML 数据表(HTML) 123 Page - Microchip Technology

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 2002 Microchip Technology Inc.
DS39597B-page 121
PIC16F72
28-Lead Plastic Quad Flat No Leads Package (ML) 6x6 mm Body (QFN)
Lead Width
* Controlling Parameter
Notes:
Mold Draft Angle Top
B
α
.009
12
.011
.014
0.23
12
0.28
0.35
D
Pitch
Number of Pins
Overall Width
Standoff
Molded Package Length
Overall Length
Molded Package Width
Molded Package Thickness
Overall Height
MAX
Units
Dimension Limits
A2
A1
E1
D
D1
E
n
p
A
.026
.236 BSC
.000
.226 BSC
INCHES
.026 BSC
MIN
28
NOM
MAX
0.65
.031
.002
0.00
6.00 BSC
5.75 BSC
MILLIMETERS*
.039
MIN
28
0.65 BSC
NOM
0.80
0.05
1.00
E
E1
n
1
2
D1
A
A2
EXPOSED
METAL
PADS
BOTTOM VIEW
.008 REF.
Base Thickness
A3
0.20 REF.
TOP VIEW
0.85
.033
.0004
0.01
.236 BSC
.226 BSC
6.00 BSC
5.75 BSC
Q
L
Lead Length
Tie Bar Width
L
.020.024
.0300.50
0.600.75
R
.005.007
.0100.13
0.170.23
Tie Bar Length
Q
.012
.016
.026
0.30
0.40
0.65
Chamfer
CH
.009.017
.0240.24
0.420.60
R
p
A1
A3
α
CH x 45
B
D2
E2
E2
D2
Exposed Pad Width
Exposed Pad Length
.140
.146
.152
3.55
3.70
3.85
.140
.146
.152
3.55
3.70
3.85
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-114



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