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PIC16F72/ML 数据表(PDF) 124 Page - Microchip Technology |
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PIC16F72/ML 数据表(HTML) 124 Page - Microchip Technology |
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124 / 136 page ![]() PIC16F72 DS39597B-page 122 2002 Microchip Technology Inc. 28-Lead Plastic Quad Flat No Leads Package (ML) 6x6 mm Body (QFN) (Continued) Pad Width *Controlling Parameter Drawing No. C04-2114 B .009 .011 .014 0.23 0.28 0.35 Pitch MAX Units Dimension Limits p INCHES .026 BSC MIN NOM MAX MILLIMETERS* MIN 0.65 BSC NOM Pad Length Pad to Solder Mask L .020 .024 .030 0.50 0.60 0.75 M .005 .006 0.13 0.15 L p M M B PACKAGE EDGE SOLDER MASK |
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