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AT83C5111 数据表(PDF) 71 Page - ATMEL Corporation

部件名 AT83C5111
功能描述  Low Pin Count 8-bit Microcontroller with A/D Converter
PDF  86 Pages
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制造商  ATMEL [ATMEL Corporation]
网页  http://www.atmel.com
标志 ATMEL - ATMEL Corporation

AT83C5111 数据表(HTML) 71 Page - ATMEL Corporation

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AT8xC5111
4190A–8051–11/02
Electrical Characteristics
Absolute Maximum Ratings (1)
Power Consumption
Measurement
Since the introduction of the first C51 devices, every manufacturer made operat ing I
CC
measurements under reset, which made sense for the designs were the CPU was run-
ning under reset. In our new devices, the CPU is no longer active during reset, so the
power consumption is very low but is not really representat ive of what will happen in the
customer system. That ’s why, while keeping measurements under Reset, we present a
new way to measure the operat ing I
CC:
Using an internal test ROM, the following code is executed:
Label:
SJMP Label (80 FE)
Ports 1, 3, 4 are disconnected, RST = V
CC, XTAL2 is not connected and XTAL1 is driven
by the clock.
This is much more representat ive of the real operat ing I
CC.
C = Commercial.................................................... 0
°C to 70°C
I = Industrial ....................................................... -40
°C to 85°C
Storage Temperat ure .................................... -65
°C to +150°C
Voltage on V
CC to VSS ...........................................-0.5V to +7V
Voltage on V
PP to VSS .........................................-0.5V to +13V
Voltage on Any Pin to V
SS...................................... -0.5V to VCC +0.5V
Power Dissipat ion .......................................................... 1 W
(2)
Notes:
1.
Stresses at or above those listed under “ Absolute
Maximum Rat ings” may cause permanent dam-
age to the device. This is a stress rat ing only and
functional operat ion of the device at these or any
other conditions above those indicat ed in the
operat ional sections of this specificat ion is not
implied. Exposure to absolute maximum rat ing
conditions may affect device reliability.
2. This value is based on the maximum allowable
die temperat ure and the thermal resistance of the
package.



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