ADAS1000-4BSTZ datasheet(14/80 Pages) AD

14 / 80 page

ADAS1000-3/ADAS1000-4

Data Sheet

Rev. B | Page 14 of 80

ABSOLUTE MAXIMUM RATINGS

Table 7.

Parameter

Rating

AVDD to AGND

−0.3 V to +6 V

IOVDD to DGND

−0.3 V to +6 V

ADCVDD to AGND

−0.3 V to +2.5 V

DVDD to DGND

−0.3 V to +2.5 V

REFIN/REFOUT to REFGND

−0.3 V to +2.1 V

ECG and Analog Inputs to AGND

−0.3 V to AVDD + 0.3 V

Digital Inputs to DGND

−0.3 V to IOVDD + 0.3 V

REFIN to ADCVDD

ADCVDD + 0.3 V

AGND to DGND

−0.3 V to + 0.3 V

REFGND to AGND

−0.3 V to + 0.3 V

ECG Input Continuous Current

±10 mA

Storage Temperature Range

−65°C to +125°C

Operating Junction Temperature Range

−40°C to +85°C

Reflow Profile

J-STD-20 (JEDEC)

Junction Temperature

150°C max

ESD

HBM

2500 V

FICDM

1000 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 8. Thermal Resistance1

Package Type

θJA

Unit

56-Lead LFCSP

°C/W

64-Lead LQFP

42.5

°C/W

1 Based on JEDEC standard 4-layer (2S2P) high effective thermal conductivity

test board (JESD51-7) and natural convection.

ESD CAUTION

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