EDB8164B4PR-1DITF-R datasheet(120/152 Pages) MICRON

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Table 82: AC Overshoot/Undershoot Specification

Applies for CA[9:0], CS_n, CKE, CK_t, CK_c, DQ, DQS_t, DQS_c, DM

Parameter

1066

933

800

667

533

466

400

333

266

200

Unit

Maximum peak amplitude provided for over-

shoot area

0.35

Maximum peak amplitude provided for under-

shoot area

0.35

Maximum area above VDD1

0.15

0.17

0.20

0.24

0.30

0.35

0.40

0.48

0.60

0.80

V-ns

Maximum area below VSS2

0.15

0.17

0.20

0.24

0.30

0.35

0.40

0.48

0.60

0.80

V-ns

Notes:

1. VDD stands for VDD2 for CA[9:0], CK_t, CK_c, CS_n, and CKE. VDD stands for VDDQ for DQ,

DM, DQS_t, and DQS_c.

2. VSS is for CA[9:0], CK_t, CK_c, CS_n, and CKE. VSS stands for VSSQ for DQ, DM, DQS_t, and

DQS_c.

Figure 78: Overshoot and Undershoot Definition

Overshoot area

Undershoot area

Maximum amplitude

Time (ns)

Notes:

1. VDD stands for VDD2 for CA[9:0], CK_t, CK_c, CS_n, and CKE. VDD stands for VDDQ for DQ,

DM, DQS_t, and DQS_c.

2. VSS is for CA[9:0], CK_t, CK_c, CS_n, and CKE. VSS stands for VSSQ for DQ, DM, DQS_t, and

DQS_c.

HSUL_12 Driver Output Timing Reference Load

The timing reference loads are not intended as a precise representation of any particu-

lar system environment or a depiction of the actual load presented by a production test-

er. System designers should use IBIS or other simulation tools to correlate the timing

reference load to a system environment. Manufacturers correlate to their production

test conditions, generally with one or more coaxial transmission lines terminated at the

tester electronics.

216-Ball and 220-Ball, Dual-Channel LPDDR2 SDRAM

Output Characteristics and Operating Conditions

09005aef85eb530a

216b_220b_2ch_2e0e_embedded_lpddr2.pdf – Rev. F 08 /16 EN

120

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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