MPC8360 datasheet(68/112 Pages) FREESCALE

部件名	MPC8360

功能描述	PowerQUICC??II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

PDF	112 Pages

Scroll/Zoom	100%

制造商	FREESCALE [Freescale Semiconductor, Inc]

网页	http://www.freescale.com

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68 / 112 page

MPC8360E/MPC8358E PowerQUICC™ II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 2

Freescale Semiconductor

Package and Pin Listings

Figure 51 provide the AC test load for the USB.

Figure 51. USB AC Test Load

21 Package and Pin Listings

This section details package parameters, pin assignments, and dimensions. The MPC8360E/58E is

available in a tape ball grid array (TBGA), see Section 21.1, “Package Parameters for the TBGA Package

and Section 21.2, “Mechanical Dimensions of the TBGA Package,” for information on the package.

21.1

Package Parameters for the TBGA Package

The package parameters for rev 2.0 silicon are as provided in the following list. The package type is 37.5

× 37.5 mm, 740 tape ball grid array (TBGA).

Package outline

37.5 mm

× 37.5 mm

Interconnects

740

Pitch

1.00 mm

Module height (typical)

1.46 mm

Solder Balls

62 Sn/36 Pb/2 Ag (ZU package)

95.5 Sn/0.5 Cu/4Ag (VV package)

Ball diameter (typical)

0.64 mm

Output

Z0 = 50 Ω

OVDD/2

RL = 50 Ω

MPC8360 数据表(PDF) 68 Page - Freescale Semiconductor, Inc