MPC8360 datasheet(10/112 Pages) FREESCALE

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MPC8360E/MPC8358E PowerQUICC™ II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 2

Freescale Semiconductor

Electrical Characteristics

2.1.2

Power Supply Voltage Specification

Table 2 provides the recommended operating conditions for the device. Note that the values in Table 2 are

the recommended and tested operating conditions. Proper device operation outside of these conditions is

not guaranteed.

Table 2. Recommended Operating Conditions

Characteristic

Symbol

Recommended

Value

Unit

Notes

Core supply voltage

For QE frequencies <500 MHz and e300 frequencies <667 MHz

For a QE frequency of 500 MHz or an e300 frequency of 667 MHz

VDD

1.2 V ± 60 mV

1.3 V ± 50 mV

PLL supply voltage

For QE frequencies <500 MHz and e300 frequencies <667 MHz

For a QE frequency of 500 MHz or an e300 frequency of 667 MHz

AVDD

1.2 V ± 60 mV

1.3 V ± 50 mV

DDR and DDR2 DRAM I/O supply voltage

DDR

DDR2

GVDD

2.5 V ± 125 mV

1.8V ± 90 mV

Three-speed Ethernet I/O supply voltage

LVDD0

3.3 V ± 330 mV

2.5 V ± 125 mV

Three-speed Ethernet I/O supply voltage

LVDD1

3.3 V ± 330 mV

2.5 V ± 125 mV

Three-speed Ethernet I/O supply voltage

LVDD2

3.3 V ± 330 mV

2.5 V ± 125 mV

PCI, local bus, DUART, system control and power management, I2C, SPI,

and JTAG I/O voltage

OVDD

3.3 V ± 330 mV

Junction temperature

0 to 105

°C2

Notes:

1. GVDD, LVDD, OVDD, AVDD, and VDD must track each other and must vary in the same direction—either in the positive or

negative direction.

2. .The operating conditions for junction temperature, TJ, on the 600/333/400 MHz and 500/333/500 MHz on rev2.0 silicon is

°C to 70 °C. Please refer to General9 in the device errata document.

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