MPC8360 datasheet(1/112 Pages) FREESCALE

部件名	MPC8360

功能描述	PowerQUICC??II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

PDF	112 Pages

Scroll/Zoom	100%

制造商	FREESCALE [Freescale Semiconductor, Inc]

网页	http://www.freescale.com

标志

1 / 112 page

Freescale Semiconductor

Technical Data

This document provides an overview of the MPC8360E/58E

PowerQUICC™ II Pro processor revision 2.x TBGA

features, including a block diagram showing the major

functional components. This device is a cost-effective,

highly integrated communications processor that addresses

the needs of the networking, wireless infrastructure and

telecommunications markets. Target applications include

next generation DSLAMs, network interface cards for 3G

basestations (Node Bs), routers, media gateways and high

end IADs. The device extends current PowerQUICC II Pro

offerings, adding higher CPU performance, additional

functionality, faster interfaces and robust interworking

between protocols while addressing the requirements related

to time-to-market, price, power, and package size. This

device can be used for the control plane along with data

plane functionality.

For functional characteristics of the processor, refer to the

MPC8360E Integrated Communications Processor Family

Reference Manual, Rev. 2.

To locate any published errata or updates for this document,

contact your Freescale sales office.

Document Number: MPC8360EEC

Rev. 2, 12/2007

Contents

1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . 8

3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 13

4. Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 15

5. RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 16

6. DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 19

7. DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

8. UCC Ethernet Controller: Three-Speed Ethernet, MII

Management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

9. Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

10. JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

11. I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

12. PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

13. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

14. GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

15. IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

16. SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

17. TDM/SI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

18. UTOPIA/POS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

19. HDLC, BISYNC, Transparent, and Synchronous

UART. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

20. USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

21. Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . . 68

22. Clocking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

23. Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

24. System Design Information . . . . . . . . . . . . . . . . . . . 104

25. Document Revision History. . . . . . . . . . . . . . . . . . . 108

26. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 108

MPC8360E/MPC8358E

PowerQUICC™ II Pro Processor

Revision 2.x TBGA Silicon

Hardware Specifications

类似零件编号 - MPC8360

制造商	部件名	数据表	功能描述
Freescale Semiconductor...	MPC8360	616Kb / 102P	PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
Freescale Semiconductor...	MPC8360	612Kb / 102P	PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
NXP Semiconductors	MPC8360	1Mb / 102P	PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications Rev. 5, 09/2011
Freescale Semiconductor...	MPC8360CVVAGDGA	612Kb / 102P	PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
Freescale Semiconductor...	MPC8360CVVAGDHA	612Kb / 102P	PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

More results

类似说明 - MPC8360

制造商	部件名	数据表	功能描述
Freescale Semiconductor...	MPC8358E	1Mb / 96P	PowerQUICC??II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications
	MPC8379E	1Mb / 114P	PowerQUICC??II Pro Processor Hardware Specifications
	MPC8315E	1Mb / 112P	PowerQUICC??II Pro Processor Hardware Specifications
	MPC8360E	1Mb / 108P	PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
	MPC8360CVVAJDGA	616Kb / 102P	PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
	MPC8314EEC	651Kb / 101P	PowerQUICC II Pro Processor Hardware Specifications
	MPC8360CZUAJDG	612Kb / 102P	PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
NXP Semiconductors	MPC8315EEC	1Mb / 106P	PowerQUICC II Pro Processor Hardware Specifications Rev. 2, 11/2011
	MPC8358EEC	1Mb / 95P	PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications Rev. 3, 01/2011
	MPC8360EEC	1Mb / 102P	PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications Rev. 5, 09/2011

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