MPC8360 datasheet(99/112 Pages) FREESCALE

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MPC8360E/MPC8358E PowerQUICC™ II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 2

Freescale Semiconductor

Thermal

4. Insert the chosen SPMF, COREPLL, CEPMF and CEPDF to the RCWL fields respectively.

Example:

•

Example A. To configure the device with CSB clock rate of 266 MHz, core rate of 400 MHz, and

QUICC Engine clock rate 300 MHz while the input clock rate is 33 MHz. Conf No. “s10” and “c1”

are selected from Table 76. SPMF is “1000,” CORPLL is “0000011,” CEPMF is “01001,” and

CEPDF is “0.”

•

Example B. To configure the device with CSBCSB clock rate of 266 MHz, core rate of 533 MHz

and QUICC Engine clock rate 400 MHz while the input clock rate is 66 MHz. Conf No. “s5h” and

“c2h” are selected from Table 76. SPMF is “0100,” CORPLL is “0000100,” CEPMF is “00110”

and CEPDF is “0.”

23 Thermal

This section describes the thermal specifications of the MPC8360E/58E.

23.1

Thermal Characteristics

Table 77 provides the package thermal characteristics for the 740 37.5 mm x 37.5 mm TBGA package.

Index

SPMF

CORE

PLL

CEPMF CEPDF

Input Clock

(MHz)

CSB Freq

(MHz)

Core Freq

(MHz)

QUICC

Engine Freq

(MHz)

400

(MHz)

533

(MHz)

667

(MHz)

1000

0000011

01001

266

400

300

∞∞

∞

0100

0000100

00110

266

533

400

∞∞

∞

Table 77. Package Thermal Characteristics for the TBGA Package

Characteristic

Symbol

Value

Unit

Notes

Junction-to-ambient Natural Convection on single layer board (1s)

RθJA

°C/W

1, 2

Junction-to-ambient Natural Convection on four layer board (2s2p)

RθJA

°C/W

1, 3

Junction-to-ambient (@1 m/s) on single layer board (1s)

RθJMA

°C/W

1, 3

Junction-to-ambient (@ 1 m/s) on four layer board (2s2p)

RθJMA

8°C/W

1, 3

Junction-to-ambient (@ 2 m/s) on single layer board (1s)

RθJMA

9°C/W

1, 3

Junction-to-ambient (@ 2 m/s) on four layer board (2s2p)

RθJMA

7°C/W

1, 3

Junction-to-board thermal

RθJB

4.5

°C/W

Junction-to-case thermal

RθJC

1.1

°C/W

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