MPC8360 datasheet(102/112 Pages) FREESCALE

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MPC8360E/MPC8358E PowerQUICC™ II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 2

102

Freescale Semiconductor

Thermal

RθJA = junction to ambient thermal resistance (°C/W)

RθJC = junction to case thermal resistance (°C/W)

RθCA = case to ambient thermal resistance (°C/W)

RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to

change the case to ambient thermal resistance, RθCA. For instance, the user can change the size of the heat

sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit

board, or change the thermal dissipation on the printed circuit board surrounding the device.

To illustrate the thermal performance of the devices with heat sinks, the thermal performance has been

simulated with a few commercially available heat sinks. The heat sink choice is determined by the

application environment (temperature, air flow, adjacent component power dissipation) and the physical

space available. Because there is not a standard application environment, a standard heat sink is not

required.

Table 78 shows heat sinks and junction-to-case thermal resistance for TBGA package.

Accurate thermal design requires thermal modeling of the application environment using computational

fluid dynamics software which can model both the conduction cooling and the convection cooling of the

air moving through the application. Simplified thermal models of the packages can be assembled using the

junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More

detailed thermal models can be made available on request.

Table 78. Heat Sinks and Junction-to-Case Thermal Resistance of TBGA Package

Heat Sink Assuming Thermal Grease

Air Flow

35x35 mm TBGA

Junction-to-Ambient

Thermal Resistance

AAVID 30x30x9.4 mm Pin Fin

Natural Convention

10.7

AAVID 30x30x9.4 mm Pin Fin

1 m/s

6.2

AAVID 30x30x9.4 mm Pin Fin

2 m/s

5.3

AAVID 31x35x23 mm Pin Fin

Natural Convention

8.1

AAVID 31x35x23 mm Pin Fin

1 m/s

4.4

AAVID 31x35x23 mm Pin Fin

2 m/s

3.7

Wakefield, 53x53x25 mm Pin Fin

Natural Convention

5.4

Wakefield, 53x53x25 mm Pin Fin

1 m/s

3.2

Wakefield, 53x53x25 mm Pin Fin

2 m/s

2.4

MEI, 75x85x12 no adjacent board, extrusion

Natural Convention

6.4

MEI, 75x85x12 no adjacent board, extrusion

1 m/s

3.8

MEI, 75x85x12 no adjacent board, extrusion

2 m/s

2.5

MEI, 75x85x12 mm, adjacent board, 40 mm Side bypass

1 m/s

2.8

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