MPC8360 datasheet(104/112 Pages) FREESCALE

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MPC8360E/MPC8358E PowerQUICC™ II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 2

104

Freescale Semiconductor

System Design Information

The Bergquist Company

800-347-4572

18930 West 78th St.

Chanhassen, MN 55317

Internet: www.bergquistcompany.com

23.3

Heat Sink Attachment

When attaching heat sinks to these devices, an interface material is required. The best method is to use

thermal grease and a spring clip. The spring clip should connect to the printed circuit board, either to the

board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces which would

lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint

lifetime of the package. Recommended maximum force on the top of the package is 10 lb force (4.5 kg

force). If an adhesive attachment is planned, the adhesive should be intended for attachment to painted or

plastic surfaces and its performance verified under the application requirements.

23.3.1

Experimental Determination of the Junction Temperature with a

Heat Sink

When heat sink is used, the junction temperature is determined from a thermocouple inserted at the

interface between the case of the package and the interface material. A clearance slot or hole is normally

required in the heat sink. Minimizing the size of the clearance is important to minimize the change in

thermal performance caused by removing part of the thermal interface to the heat sink. Because of the

experimental difficulties with this technique, many engineers measure the heat sink temperature and then

back calculate the case temperature using a separate measurement of the thermal resistance of the

interface. From this case temperature, the junction temperature is determined from the junction to case

thermal resistance.

TJ = TC + (RθJC × PD)

where:

TJ = junction temperature (°C)

TC = case temperature of the package (°C)

RθJC = junction to case thermal resistance (°C/W)

PD = power dissipation (W)

24 System Design Information

This section provides electrical and thermal design recommendations for successful application of the

MPC8360E/58E. Additional information can be found in AN3097, MPC8360E/MPC8358E

PowerQUICC™ Design Checklist, Rev. 1.

MPC8360 数据表(PDF) 104 Page - Freescale Semiconductor, Inc

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