ST7263BEx datasheet(185/186 Pages) STMICROELECTRONICS

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ST7263Bxx

Revision history

Doc ID 7516 Rev 8

185/186

03-Oct-06

Important Notes section renamed to Known Limitations, Section 16:

Known limitations

New PA2 limitation added, Section 16: Known limitations

Figure 85 on page 183 added for silicon revision identification

20-Aug-07

New 16K LQFP48 package added to product family.

Note added to VOH data in Section Table 71.: Output driving current

List of supported partnumber availability updated, Table 86

Download address updated in Section 15.3.4: Order codes for

ST7263Bx development tools and Option list.

12-Jun-2009

Removed FASTROM devices as well as 32 and 16 Kbyte ROM

devices.

Added caution note in Section 6.1: Reset.

Replaced CCR by CC (Condition Code) register when the I bit is

concerned.

Updated alternate function condition for PB4 to PB7 in Table 13: Port

B description.

Renamed tDOG and TDOGL, tWDG and tWDGL.

Removed EMC protective circuitry in Figure 74: RESET pin

protection when LVD is disabled (device works correctly without

these components).

Removed all mentions to SPI interface.

Removed dynamic latchup in Section 13.7.3: Absolute maximum

ratings (electrical sensitivity).

Modified notes below Table 85: Thermal characteristics.

Update Table 86: Supported order codes and Figure 84: Option list.

Updated ECOPACK text, and removed recommended wave

soldering profile and recommended reflow soldering oven profile, in

Section 14: Package characteristics.

Table 89.

Document revision history (continued)

Date

Revision

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ST7263BEx 数据表(PDF) 185 Page - STMicroelectronics

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