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H5GQ1H24AFR-R0C 数据表(PDF) 123 Page - Hynix Semiconductor |
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H5GQ1H24AFR-R0C 数据表(HTML) 123 Page - Hynix Semiconductor |
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123 / 173 page  This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any responsability for use of circuits described. No patent licenses are implied. Rev. 1.0 /Nov. 2009 123 H5GQ1H24AFR 3. Theta_JB measured with the special boundary condition defined in JESD51‐8 4. Theta_JA should only be used for comparing the thermal performance of single package and not for system related junction. 5. Theta_JA is the natural convection junction‐to‐ambient air thermal resistance measured in one cubic foot sealed enclosure as decribed in JESD 51‐2. The environment is sometimes refered to as “still‐air” although natural convection causes the air to move. 6. Theta_JC case surface is defined as the “outside surface of the package (case) closest to the chip mounting area when that same surface is properly hear sunk” so as to minimize temperature variation across that surface. |
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