CYWUSB6953_10 datasheet(66/68 Pages) CYPRESS

部件名	CYWUSB6953

功能描述	Programmable Radio on Chip Low Power

PDF	68 Pages

Scroll/Zoom	100%

制造商	CYPRESS [Cypress Semiconductor]

网页	http://www.cypress.com

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66 / 68 page

CYRF69103

Document #: 001-07611 Rev *F

Page 66 of 68

28. Package Handling

Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving

the factory. A label on the packaging has details about actual bake temperature and the minimum bake time to remove this

moisture.The maximum bake time is the aggregate time that the parts are exposed to the bake temperature. Exceeding this exposure

time may degrade device reliability.

29. Package Diagram

Figure 29-1. 40-Pin Pb-Free QFN 6x6 mm

27. Ordering Information

Package

Ordering Part Number

40-Pin Pb-Free QFN 6x6 mm

CYRF69103-40LFXC

Table 28-1. Package Handling

Parameter

Description

Min

Typ

Max

Unit

TBAKETEMP

Bake Temperature

125

see package label

°C

TBAKETIME

Bake Time

see package label

hours

001-12917 *B

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