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AX2000 数据表(PDF) 54 Page - Microsemi Corporation |
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AX2000 数据表(HTML) 54 Page - Microsemi Corporation |
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54 / 262 page ![]() Detailed Specifications 2- 40 R e v i sio n 1 8 3.3 V PCI, 3.3 V PCI-X Peripheral Component Interface for 3.3 V standard specifies support for both 33 MHz and 66 MHz PCI bus applications. It uses an LVTTL input buffer and a push-pull output buffer. The input and output buffers are 5 V tolerant with the aid of external components. Axcelerator 3.3 V PCI and 3.3 V PCI-X buffers are compliant with the PCI Local Bus Specification Rev. 2.1. The PCI Compliance Specification requires the clamp diodes to be able to withstand for 11 ns, –3.5 V in undershoot, and 7.1 V in overshoot. AC Loadings Table 2-33 • DC Input and Output Levels VIL VIH VOL VOH IOL IOH Min., V Max., V Min., V Max., V Max., V Min., V mA mA PCI –0.3 0.3 VCCI 0.5 VCCI VCCI + 0.5 (per PCI specification) PCI-X –0.5 0.35 VCCI 0.5 VCCI VCCI + 0.5 (per PCI specification) Figure 2-18 • AC Test Loads Table 2-34 • AC Waveforms, Measuring Points, and Capacitive Loads Input Low (V) Input High (V) Measuring Point* (V) VREF (typ) (V) Cload (pF) (Per PCI Spec and PCI-X Spec) N/A 10 Note: * Measuring Point = VTRIP R to VCCI for tpl R to GND for tph 10 pF GND Test point for data R = 25 35 pF for tpzl / tpzh 5 pF for tphz / tplz R to VCCI for tplz / tpzl R to GND for tphz / tpzh Test Point for tristate R = 1k |
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