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SPC560P34L1 数据表(PDF) 54 Page - STMicroelectronics |
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SPC560P34L1 数据表(HTML) 54 Page - STMicroelectronics |
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54 / 103 page  Electrical characteristics SPC560P34L1, SPC560P34L3, SPC560P40L1, SPC560P40L3 54/103 Doc ID 16100 Rev 7 3.6 Electromagnetic interference (EMI) characteristics 3.7 Electrostatic discharge (ESD) characteristics 3.8 Power management electrical characteristics 3.8.1 Voltage regulator electrical characteristics The internal voltage regulator requires an external NPN ballast, approved ballast list availbale in Table 15, to be connected as shown in Figure 10. Capacitances should be placed on the board as near as possible to the associated pins. Care should also be taken to limit the serial inductance of the VDD_HV_REG, BCTRL and VDD_LV_CORx pins to less than LReg. (refer to Table 16). Table 13. EMI testing specifications Symbol Parameter Conditions Clocks Frequency Level (Typ) Unit VEME Radiated emissions VDD = 5.0 V; TA =25 °C Other device configuration, test conditions and EM testing per standard IEC61967-2 fOSC =8 MHz fCPU =64 MHz No PLL frequency modulation 150 kHz–150 MHz 11 dBµ V 150–1000 MHz 13 IEC level M — fOSC =8 MHz fCPU =64 MHz ±4% PLL frequency modulation 150 kHz–150 MHz 8 dBµ V 150–1000 MHz 12 IEC level N — VDD = 3.3 V; TA =25 °C Other device configuration, test conditions and EM testing per standard IEC61967-2 fOSC =8 MHz fCPU =64 MHz No PLL frequency modulation 150 kHz–150 MHz 9 dBµ V 150–1000 MHz 12 IEC level M — fOSC =8 MHz fCPU =64 MHz ±4% PLL frequency modulation 150 kHz–150 MHz 7 dBµ V 150–1000 MHz 12 IEC level N — Table 14. ESD ratings(1),(2) Symbol Parameter Conditions Value Unit VESD(HBM) S R Electrostatic discharge (Human Body Model) — 2000 V VESD(CDM) S R Electrostatic discharge (Charged Device Model) — 750 (corners) V 500 (other) 1. All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive Grade Integrated Circuits. 2. A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device specification requirements. Complete DC parametric and functional testing shall be performed per applicable device specification at room temperature followed by hot temperature, unless specified otherwise in the device specification. |
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