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AM186ED-20KC/W 数据表(PDF) 51 Page - Advanced Micro Devices

部件名 AM186ED-20KC/W
功能描述  High Performance, 80C186- and 80C188-Compatible, 16-Bit Embedded Microcontrollers
PDF  88 Pages
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制造商  AMD [Advanced Micro Devices]
网页  http://www.amd.com
标志 AMD - Advanced Micro Devices

AM186ED-20KC/W 数据表(HTML) 51 Page - Advanced Micro Devices

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Am186ED/EDLV Microcontrollers
51
PRELI M INARY
D
RA
F T
THERMAL CHARACTERISTICS
TQFP Package
Th e Am 186ED microcontroller is sp ecifie d for
operation with case temperature ranges from 0
°C to
+100
°C for a commercial device. Case temperature is
measured at the top center of the package as shown in
Figure 13. The various temperatures and thermal
resistances can be determined using the equations in
Figure 14 with information given in Table 11.
The total thermal resistance is
θ
JA; θJA is the sum of
θ
JC, the internal thermal resistance of the assembly,
and
θ
CA, the case to ambient thermal resistance.
The variable
P is power in watts. Power supply current
(ICC) is in mA per MHz of clock frequency.
Figure 13.
Thermal Resistance(
°C/Watt)
Figure 14.
Thermal Characteristics Equations
Table 11.
Thermal Characteristics (
°C/Watt)
θ
JA
θ
CA
θ
JC
θ
JA = θJC + θCA
TC
Package/Board
Airflow
(Linear Feet
per Minute)
θ
JA
θ
JC
θ
CA
PQFP/2-Layer
0 fpm
45
7
38
200 fpm
39
7
32
400 fpm
35
7
28
600 fpm
33
7
26
TQFP/2-Layer
0 fpm
56
10
46
200 fpm
461036
400 fpm
401030
600 fpm
381028
PQFP/4-Layer
to 6-Layer
0 fpm
23518
200 fpm
21
5
16
400 fpm
19
5
14
600 fpm
17
5
12
TQFP/4-Layer
to 6-Layer
0 fpm
30624
200 fpm
28
6
22
400 fpm
26
6
20
600 fpm
24
6
18
θ
JA = θJC + θCA
P=ICC
⋅ freq (MHz) ⋅ V
CC
TJ=TC+( P
⋅θ
JC )
TJ=TA+ ( P
⋅θ
JA )
TC=TJ–( P
⋅θ
JC )
TC=TA+( P
⋅θ
CA )
TA=TJ–( P
⋅θ
JA )
TA=TC–( P
⋅θ
CA )



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