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XIO2000 数据表(PDF) 136 Page - Texas Instruments

部件名 XIO2000
功能描述  XIO2000 PCI Express to PCI Bus Translation Bridge
PDF  150 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

XIO2000 数据表(HTML) 136 Page - Texas Instruments

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Electrical Characteristics
124
November 2005
SCPS097B
7
Electrical Characteristics
7.1
Absolute Maximum Ratings Over Operating Temperature Ranges
Supply voltage range:
VDD_33
–0.5 V to 3.6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VDD_15
–0.5 V to 1.65 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VCCP
–0.5 V to 5.25 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range,
VI: PCI
–0.5 V to VCCP + 0.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VI: PCI Express (RX)
–0.6 V to 0.6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VI: PCI Express REFCLK (single-ended)
–0.5 V toVDD_33 + 0.5 V
. . . . . . . . . . . .
VI: PCI Express REFCLK (differential)
–0.5 V toVDD_15 + 0.5 V
. . . . . . . . . . . . . .
VI: Miscellaneous 3.3-V IO
–0.5 V to VDD_33 + 0.5 V
. . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range:
VO: PCI
–0.5 V to VDD_33 + 0.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VO: PCI Express (TX)
–0.5 V to VDD_15 + 0.5V
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
VO: Miscellaneous 3.3-V IO
–0.5 V to VDD_33 + 0.5 V
. . . . . . . . . . . . . . . . . . . . . .
Input clamp current, (VI < 0 or VI > VDD) (see Note 1)
±20 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, (VO < 0 or VO > VDD) (see Note 2)
±20 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Human body model (HBM) ESD performance
1500 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Charged device model (CDM) ESD performance
500 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg
–65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
† Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. Applies for external input and bidirectional buffers. VI < 0 or VI > VDD or VI > VCCP.
2. Applies to external output and bidirectional buffers. VO < 0 or VO > VDD or VO > VCCP.
7.2
Recommended Operation Conditions
OPERATION
MIN
NOM
MAX
UNITS
VDD_15
Supply voltage
1.5 V
1.35
1.5
1.65
V
VDDA_15
Supply voltage
1.5 V
1.35
1.5
1.65
V
VDD_33
VDDA_33
Supply voltage
3.3 V
3
3.3
3.6
V
VDDA_33_AUX
Supply voltage
3.3 V
3
3.3
3.6
V
VCCP
PCI bus clamping rail voltage
3.3 V
3
3.3
3.6
V
VCCP
PCI bus clamping rail voltage
5.0 V
4.75
5
5.25
V
TA
Operating ambient temperature range
0
25
70
_C
TJ
Virtual junction temperature (Note 3)
0
25
115
_C
NOTE 3: The junction temperature reflects simulated conditions. The customer is responsible for verifying junction temperature.



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