LSM6DSTX datasheet(2/175 Pages) STMICROELECTRONICS

2 / 175 page

The LSM6DSTX supports main OS requirements, offering real, virtual, and batch sensors with 9 KB for

dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing

processes already used for the production of micromachined accelerometers and gyroscopes. The various

sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are

developed using CMOS technology that allows the design of a dedicated circuit, which is trimmed to better match

the characteristics of the sensing element.

The LSM6DSTX has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of

±125/±250/±500/±1000/±2000 dps.

The LSM6DSTX fully supports EIS and OIS applications as the module includes a dedicated configurable signal

processing path for OIS and an auxiliary SPI, configurable for both the gyroscope and accelerometer. The

LSM6DSTX OIS can be configured from the auxiliary SPI and primary interface (SPI / I²C & MIPI I3CSM).

The LSM6DSTX embeds a machine learning core able to identify if a data pattern matches an activity in a

user-defined set of classes, reducing power consumption and increasing performance of the sensor.

High robustness to mechanical shock makes the LSM6DSTX the preferred choice of system designers for the

creation and manufacturing of reliable products. The LSM6DSTX is available in a plastic land grid array (LGA)

package.

LSM6DSTX

DS14039 - Rev 1

page 2/175

LSM6DSTX 数据表(PDF) 2 Page - STMicroelectronics