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C5C5EDELTA-RM/D 数据表(PDF) 78 Page - NXP Semiconductors |
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C5C5EDELTA-RM/D 数据表(HTML) 78 Page - NXP Semiconductors |
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78 / 114 page  78 CHAPTER 3: ELECTRICAL SPECIFICATIONS C large mass of the heat sink, attachment through the printed circuit board is suggested. If a spring clip is used, the spring force should not exceed 5.5 pounds. Figure 10 Package Cross Section View with Several Heat Sink Options Internal Package Conduction Resistance For the exposed-die packaging technology the intrinsic conduction thermal resistance paths are as follows: • The die junction-to-case (or top-of-die for exposed silicon) thermal resistance • The die junction-to-ball thermal resistance Figure 11 depicts the primary heat transfer path for a package with an attached heat sink mounted to a printed-circuit board. CBGA Package Heat Sink Heat Sink Clip Thermal Interface Material Printed Circuit Board Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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