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TDA4VEN...Q1 数据表(PDF) 92 Page - Texas Instruments |
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TDA4VEN...Q1 数据表(HTML) 92 Page - Texas Instruments |
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92 / 236 page  6.7 VPP Specifications for One-Time Programmable (OTP) eFuses This section specifies the operating conditions required for programming the OTP eFuses . 6.7.1 Recommended Operating Conditions for OTP eFuse Programming over operating junction temperature range (unless otherwise noted) PARAMETER DESCRIPTION MIN NOM MAX UNIT VDD_CORE Supply voltage range for the core domain during OTP operation; OPP NOM (BOOT) See Recommended Operating Conditions V VPP Supply voltage range for the eFuse ROM domain during normal operation without hardware support to program eFuse ROM NC(1) V Supply voltage range for the eFuse ROM domain during normal operation with hardware support to program eFuse ROM 0 V Supply voltage range for the eFuse ROM domain during OTP programming(2) 1.71 1.8 1.89 V I(VPP) VPP current 400 mA SR(VPP) VPP Power-up Slew Rate 6E + 4 V/s Tj Operating junction temperature range while programming eFuse ROM. 0 25 85 °C (1) NC indicates No Connect. (2) Supply voltage range includes DC errors and peak-to-peak noise. 6.7.2 Hardware Requirements The following hardware requirements must be met when programming keys in the OTP eFuses: • The VPP power supply must be disabled when not programming OTP registers. • The VPP power supply must be ramped up after the proper device power-up sequence (for more details, see Section 6.9.2.2, Power Supply Sequencing). 6.7.3 Programming Sequence Programming sequence for OTP eFuses: • Power on the board per the power-up sequencing. No voltage should be applied on the VPP terminal during power up and normal operation. • Load the OTP write software required to program the eFuse (contact your local TI representative for the OTP software package). • Apply the voltage on the VPP terminal according to the specification in Section 6.7.1. • Run the software that programs the OTP registers. • After validating the content of the OTP registers, remove the voltage from the VPP terminal. 6.7.4 Impact to Your Hardware Warranty You accept that e-Fusing the TI Devices with security keys permanently alters them. You acknowledge that the e-Fuse can fail, for example, due to incorrect or aborted program sequence or if you omit a sequence step. Further the TI Device may fail to secure boot if the error code correction check fails for the Production Keys or if the image is not signed and optionally encrypted with the current active Production Keys. These types of situations will render the TI Device inoperable and TI will be unable to confirm whether the TI Devices conformed to their specifications prior to the attempted e-Fuse. CONSEQUENTLY, TI WILL HAVE NO LIABILITY (WARRANTY OR OTHERWISE) FOR ANY TI DEVICES THAT HAVE BEEN e-FUSED WITH SECURITY KEYS. TDA4VEN-Q1, TDA4AEN-Q1 SPRSP96A – MARCH 2024 – REVISED SEPTEMBER 2024 www.ti.com 92 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: TDA4VEN-Q1 TDA4AEN-Q1 |
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