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TDA4VEN...Q1 数据表(PDF) 123 Page - Texas Instruments |
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TDA4VEN...Q1 数据表(HTML) 123 Page - Texas Instruments |
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123 / 236 page ![]() NO. MODE MIN MAX UNIT D9 tw(bwsH) Pulse Duration, ATL_BWS[x] high(3) External reference clock 0.45 × B(2) + 2.5 ns (1) M = ATL_CLK[x] period (2) B = ATL_BWS[x] period (3) x = 0 to 3 6.9.5.1.4 ATCLK[x] Switching Characteristics NO. PARAMETER MODE MIN MAX UNIT D10 tc(atclk) Cycle time, ATCLK[x](3) Internal reference CLK 20 ns D11 tw(atclkL) Pulse Duration, ATCLK[x] low(3) Internal reference CLK 0.45 × P(2) - M(1) - 0.3 ns D12 tw(atclkH) Pulse Duration, ATCLK[x] high(3) Internal reference CLK 0.45 × P(2) - M(1) - 0.3 ns (1) M = ATL_CLK[x] period (2) P = ATCLK[x] period (3) x = 0 to 3 ATCLK[x] D12 D11 D10 atl_01 Figure 6-26. ATCLK[x] Timing 6.9.5.2 CPSW3G For more details about features and additional description information on the device Gigabit Ethernet MAC, see the corresponding subsections within Signal Descriptions and Detailed Description sections. 6.9.5.2.1 CPSW3G MDIO Timing Table 6-28, Table 6-29, Table 6-30, and Figure 6-27 present timing conditions, timing requirements, and switching characteristics for CPSW3G MDIO. Table 6-28. CPSW3G MDIO Timing Conditions PARAMETER MIN MAX UNIT INPUT CONDITIONS SRI Input slew rate 0.9 3.6 V/ns OUTPUT CONDITIONS CL Output load capacitance 10 470 pF PCB CONNECTIVITY REQUIREMENTS td(Trace Delay) Propagation delay of each trace 0 5 ns td(Trace Mismatch Delay) Propagation delay mismatch across all traces 1 ns Table 6-29. CPSW3G MDIO Timing Requirements see Figure 6-27 NO. PARAMETER MIN MAX UNIT MDIO1 tsu(MDIO_MDC) Setup time, MDIO[x]_MDIO valid before MDIO[x]_MDC high 45 ns MDIO2 th(MDC_MDIO) Hold time, MDIO[x]_MDIO valid after MDIO[x]_MDC high 0 ns www.ti.com TDA4VEN-Q1, TDA4AEN-Q1 SPRSP96A – MARCH 2024 – REVISED SEPTEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 123 Product Folder Links: TDA4VEN-Q1 TDA4AEN-Q1 |
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