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ST40RA 数据表(PDF) 75 Page - STMicroelectronics |
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ST40RA 数据表(HTML) 75 Page - STMicroelectronics |
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75 / 94 page ![]() 9 Package ST40RA 75/94 STMicroelectronics ADCS 7260755H 9 Package Physical properties: q 27 x 27 mm 372 plastic ball grid array (PBGA) (336 + 36 thermal ground balls), q Typical power consumption <2 W, q Substrate height: 0.56 mm, q Total height: 2.33 mm, q Cover + substrate: 1.73 mm. Figure 19 and Figure 20 are diagrams of the pin disposition on the package. . Figure 19: 372-pin PBGA package = = == f D e A B C D E F G H J K L M N P R T U V W Y 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 D1 Detail D Option: 36 thermal balls |
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