AX2000 datasheet(256/262 Pages) MICROSEMI

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Datasheet Information

4- 2

R ev isio n 1 8

Revision 17

(continued)

The C180 package was removed from product tables and the "Package Pin

Assignments" section (PDN 0909).

3-1

Package names used in the"Axcelerator Family Product Profile" and "Package

Pin Assignments" section were revised to match standards given in Package

Mechanical Drawings

(SAR 27395).

i, 3-1

The "Introduction" section for "User I/Os" was updated as follows:

"The user does not need to assign VREF pins for OUTBUF and TRIBUF. VREF

pins are needed only for input and bidirectional I/Os" (SARs 24181, 24309).

2-11

Power values in Table 2-4 • Default CLOAD/VCCI were updated to reflect those

of SmartPower (SAR 33945).

2-3

Two parameter names were corrected in Figure 2-10 • Output Buffer Delays.

One occurrence of tENLZ was changed to tENZL and one occurrence of tENHZ

was changed to tENZH (SAR 33890).

2-22

The "Timing Model" section was updated with new timing values. Timing tables

in the "I/O Specifications" section were updated to include enable paths. Values

in the timing tables in the "Voltage-Referenced I/O Standards" section and

"Differential Standards" section were updated. Table 2-63 • R-Cell was updated

(SAR 33945).

2-8, 2-26 to

2-53

Figure 2-11 • Timing Model was replaced (SAR 33043).

2-23

The timing tables for "RAM" and "FIFO" were updated (SAR 33945).

2-90 to 2-106

"Data Registers (DRs)" values were modified for IDCODE and USERCODE

(SARs 18257, 26406).

2-108

The package diagram for the "CQ208" package was incorrect and has been

replaced with the correct diagram (SARs 23865, 26345).

3-89

Revision 16

(v2.8, Oct. 2009)

The datasheet was updated to include AX2000-CQ2526 information.

N/A

MIL-STD-883 Class B is no longer supported by Axcelerator FPGAs and as a

result was removed.

N/A

A footnote was added to the "Introduction" in the "Axcelerator Clock

Management System" section.

2-75

Revision 15

(v2.7, Nov. 2008)

RoHS-compliant information was added to the "Ordering Information".

ACTgen was changed to SmartGen because ACTgen is obsolete.

N/A

Revision 14

(v2.6)

In Table 2-4, the units for the PLOAD, P10, and PI/O were updated from mW/MHz

to mW/MHz.

2-3

In the "Pin Descriptions"section, the HCLK and CLK descriptions were updated

to include tie-off information.

2-9

The "Global Resource Distribution" section was updated.

2-70

The " CG624" table was updated.

3-116

Revision 13

(v2.5)

A note was added to Table 2-2.

2-1

In the "Package Thermal Characteristics", the temperature was changed from

150°C to 125°C.

2-6

Revision

Changes

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