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RM0319 数据表(PDF) 30 Page - STMicroelectronics |
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RM0319 数据表(HTML) 30 Page - STMicroelectronics |
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30 / 368 page ![]() Multilayer interconnect matrix (BUSMATRIX) RM0319 30/368 Doc ID 022640 Rev 3 4 Multilayer interconnect matrix (BUSMATRIX) This chapter focuses on BUSMATRIX functionality and operation. For technical details about the programmable registers related to the BUSMATRIX, refer to the system configuration registers (MISC) in the following companion document: ● RM0321: SPEAr320S address map and registers 4.1 Overview The internal architecture is based on several shared subsystem logics interconnected through a multilayer interconnection matrix, shown in Figure 3. The BUSMATRIX has 7 master inputs: two DMA inputs, and one input each for the CPU, Reconfigurable Array Subsystem (RAS) block, Ethernet controller, USB controllers and C3. There are 10 slave outputs connected to almost all the system blocks: low speed subsystem, application subsystem, basic subsystem, high speed subsystem, RAS and MPMC DDR memory controller ports. |
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