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RM0319 数据表(PDF) 31 Page - STMicroelectronics

部件名 RM0319
功能描述  SPEAr320S architecture and functionality
PDF  368 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

RM0319 数据表(HTML) 31 Page - STMicroelectronics

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RM0319
Multilayer interconnect matrix (BUSMATRIX)
Doc ID 022640 Rev 3
31/368
Figure 3.
SPEAr320S block diagram with BUSMATRIX topology details
The switch matrix structure allows different subsystem dataflows to be executed in parallel
improving the core platform efficiency.
High performance master agents are directly interconnected with the memory controller
reducing the memory access latency. Three different memory paths (two of them shared
with other masters) are reserved for the programmable logic to enhance the user application
throughput. The overall memory bandwidth assigned to each master port can be
programmed and optimized through an internal efficient weighted round-robin arbitration
mechanism.
Table 3 shows the connectivity matrix.
Multilayer AHB interconnect matrix
Multiport memory
controller
DDR memory interface
JTAG/ETM9
Reconfigurable array subsystem
ARM926EJS
GPIO
Int.Ctrl
Timer
QP
RI-O
M0
cfg
102
56
0/18 MII
to PHY
Oscillator
0÷6
0÷7
0÷2
0÷2
98 GPIO, 4clk
Master
reset
10
Low speed
subsystem
Basic subsystem
2
5
2
1
0÷6
C
I
Debug
12
8 chan.
Master
clock
0÷8
DDR
3-12
4
3
SPEAr320S
16KB
Instr Cache
16KB
Data Cache
System
controller
Timer
RTC
GPIO
SMI
CPU subsystem
8KB
SRAM
JPEG
Codec
IrDA
I2C0
SSP0
UART0
ADC
74.5 KB RAM
Cuts:
Half Dual Port
(AHB wired):
2048 *32 *1
Dual Port:
96 *128 *1
1024 *32 *4
128 *8 *8
Single Port:
2048 *32 *2
1024 *32 *2
512 *32 *4
2048 *8 *8
Application
subsystem
C3
USB 2.0
Host
USB 2.0
Device
Ethernet
MAC
High speed
subsystem
8-channel
DMA
32KB
ROM
MISC
Watchdog
timer
SDIO
MII
CLCD
FSMC/
EMI
SSP1/2
SPP
UART1
to UART6
PWM
CAN0/1
Touch-
screen
I2C1/2
M
H
G
F
E
L
D
B
A
3 4
1
5
7
6
2
5-23
9-4
10-6
4-12
2-12(4)
6-67
7-34
8-5
1-123
M2
M1
M3
M4
RMII0/1
I2S
RS485
CLCD



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