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AD6676EBZ 数据表(PDF) 58 Page - Analog Devices

部件名 AD6676EBZ
功能描述  Wideband IF Receiver Subsystem
PDF  90 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

AD6676EBZ 数据表(HTML) 58 Page - Analog Devices

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AD6676
Data Sheet
Rev. A | Page 58 of 90
•
All critical passive components, such as dc blocking and
power supply decoupling capacitors, are 0201 size and placed
on top side of the PCB. Two 0201 decoupling capacitors
(0.001 µF and 0.1 µF) are placed adjacent to supply pins
with the lower value placed closer to the AD6676.
•
The analog 1.1 V supply pins of the AD6676 share a common
1.1 V supply domain and are tied together below the device.
•
VSS2OUT (Pin G7) must be connected to VSS2IN (Pin F6)
on the top side layer of the PCB.
•
The alternative layout shown in Figure 141 uses 0.2 mm
through-hole vias just outside of the AD6676 package for
all supply and ground domains with all of the 1.1 V analog
supply domains (VDD1, VDDL, VDDC, and VDDQ)
connected to each other providing a low impedance path to
the critical inner VDD1 and VDDL balls. This alternative
layout also avoids any narrow signal traces to inner row balls
(with exception of CSB) by using a 3-wire SPI interface (with
the SDIO, RESETB, AGC4, and AGC3 balls left open).
Note that the thin inner trace for CSB (positioned between
the SCLK and SYNCINB− balls) could have been avoided
by running a wider straight trace instead of connecting the
CSB and SYNCINB− balls because, by default, the SYNCINB
input is configured for a CMOS input with only SYNCINB+
used for signaling (and SYNCINB− ignored).
Figure 140. AD6676EBZ PCB Top Side Layout Example
Figure 141. Alternative PCB Top Side Layout Example That Avoids a Through
Hole Via under the Device
Additional information specifically pertaining to the WLCSP
package considerations is contained in the AN-617 Application
Note. This application note covers PCB design guidelines,
assembly, reliability, and rework in detail.



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