AD6676EBZ datasheet(9/90 Pages) AD

9 / 90 page

Data Sheet

AD6676

Rev. A | Page 9 of 90

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

VDD1, VDDC, VDDL, VDDQ to VSSA

−0.2 V to +1.2 V

VDD2 to VSSA

−0.3 V to +3.0 V

VDD2NV to VSSA

−0.3 V to +3.0 V

VSS2IN, VSS2OUT to VSSA

−2.5 V to +0.3 V

VDDD, VDDHSI to VSSD

−0.2 V to +1.2 V

VDDIO to VSSD

−0.3 V to +3.0 V

VIN+, VIN− to VSSA

−0.3 V to VDD2 + 0.3 V

L+, L− to VSSA

−0.3 V to VDD2 + 0.3 V

CLK+, CLK− to VSSA

−0.3 V to VDDC + 0.3 V

SYSREF+, SYSREF−, SERDOUT0+,

SERDOUT0−, SERDOUT1+,

SERDOUT1− to VSSD

−0.3 V to VDDHSI + 0.3 V

SYNCINB+, SYNCINB− to VSSD

−0.3 V to VDDIO + 0.3 V

CSB, SDO, SDIO, SCLK, RESETB, AGC1,

AGC2, AGC3, AGC4 to VSSD

−0.3 V to VDDIO + 0.3 V

Normal Operating Temperature Range

−40°C to +85°C

Maximum Junction Temperature

Under Bias

125°C

Storage Temperature Range

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Typical θJA is specified for a 4-layer printed circuit board (PCB)

with a solid ground plane in conformance to JESD51-9 2s2p. In

addition, metal in direct contact with the package leads from

metal traces, through holes, ground, and power planes reduces

the value of θJA.

Table 5. Thermal Resistance

Package Type

Unit

4.3 mm × 5.0 mm WLCSP

0.2

4.5

°C/W

ESD CAUTION

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