AD6676EBZ datasheet(90/90 Pages) AD

90 / 90 page

AD6676

Data Sheet

Rev. A | Page 90 of 90

OUTLINE DIMENSIONS

0.660

0.600

0.540

4.33

4.29

4.25

5.08

5.04

5.00

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

SIDE VIEW

0.270

0.240

0.210

0.390

0.360

0.330

0.360

0.320

0.280

4.50 REF

3.50 REF

0.50

BALL PITCH

0.36

0.27

0.43

BALL A1

IDENTIFIER

COPLANARITY

0.05

SEATING

PLANE

Figure 151. 80-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-80-5)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

AD6676BCBZRL

−40°C to +85°C

80-Ball Wafer Level Chip Scale Package [WLCSP]

CB-80-5

AD6676EBZ

Evaluation Board

1 Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D12348-0-9/15(A)

AD6676EBZ 数据表(PDF) 90 Page - Analog Devices

AD6676EBZ 数据表(HTML) 90 Page - Analog Devices

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