MC56F81663 datasheet(2/73 Pages) NXP

2 / 73 page

Table of Contents

1 Overview............................................................................................ 3

1.1

Product Family........................................................................ 3

1.2

56800EX 32-bit Digital Signal Controller (DSC) core...........4

1.3

Operation Parameters.............................................................. 4

1.4

Interrupt Controller................................................................. 5

1.5

Peripheral highlights............................................................... 5

1.6

System Block Diagram............................................................13

2 MC56F81xxx signal and pin descriptions..........................................15

3 Signal groups......................................................................................25

4 Pinout................................................................................................. 26

4.1

Signal Multiplexing and Pin Assignments.............................. 26

4.2

Pinout diagrams.......................................................................28

5 Ordering parts.....................................................................................31

5.1

Determining valid orderable parts...........................................31

5.2

Part number list....................................................................... 31

6 Part identification............................................................................... 32

6.1

Description.............................................................................. 32

6.2

Format..................................................................................... 32

6.3

Fields....................................................................................... 32

6.4

Example...................................................................................33

7 Package marking information............................................................ 33

8 Terminology and guidelines...............................................................34

8.1

Definition: Operating requirement.......................................... 34

8.2

Definition: Operating behavior............................................... 34

8.3

Definition: Attribute................................................................35

8.4

Definition: Rating....................................................................35

8.5

Result of exceeding a rating.................................................... 35

8.6

Relationship between ratings and operating requirements......36

8.7

Guidelines for ratings and operating requirements................. 36

8.8

Definition: Typical value........................................................ 37

8.9

Typical value conditions......................................................... 38

9 Ratings................................................................................................38

9.1

Thermal handling ratings........................................................ 38

9.2

Moisture handling ratings........................................................38

9.3

ESD handling ratings.............................................................. 38

9.4

Voltage and current operating ratings..................................... 39

10 General............................................................................................... 39

10.1 General characteristics............................................................ 39

10.2 AC electrical characteristics....................................................40

10.3 Nonswitching electrical specifications....................................41

10.4 Switching specifications..........................................................47

10.5 Thermal specifications............................................................ 47

11 Peripheral operating requirements and behaviors.............................. 49

11.1 Core modules...........................................................................49

11.2 System modules.......................................................................50

11.3 Clock modules.........................................................................50

11.4 Memories and memory interfaces........................................... 53

11.5 Analog..................................................................................... 55

11.6 PWMs and timers.................................................................... 61

11.7 Communication interfaces.......................................................62

12 Design Considerations....................................................................... 67

12.1 Thermal design considerations................................................67

12.2 Electrical design considerations.............................................. 69

12.3 Power-on Reset design considerations....................................70

13 Obtaining package dimensions.......................................................... 71

14 Product documentation.......................................................................72

15 Revision history................................................................................. 72

MC56F81xxx, Rev. 1.1, 12/2020

NXP Semiconductors

MC56F81663 数据表(PDF) 2 Page - NXP Semiconductors

MC56F81663 数据表(HTML) 2 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73

数据表下载