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MC56F81663 数据表(PDF) 42 Page - NXP Semiconductors |
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MC56F81663 数据表(HTML) 42 Page - NXP Semiconductors |
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42 / 73 page ![]() Table 7. Voltage and current operating requirements Symbol Description Min. Typ. Max. Unit Notes • Negative current injection –25 — mA 1. All I/O pins are internally clamped to VSS through a ESD protection diode. There is no diode connection to VDD. If VIN greater than VIO_MIN (= VSS-0.3 V) is observed, then there is no need to provide current limiting resistors at the pads. If this limit cannot be observed then a current limiting resistor is required. The negative DC injection current limiting resistor is calculated as R = (VIO_MIN - VIN)/|IICIO|. 10.3.2 LVD and POR operating requirements Table 8. PMC Low-Voltage Detection (LVD) and Power-On Reset (POR) Parameters Characteristic Symbol Min Typ Max Unit POR Assert Voltage1 POR 2.0 V POR Release Voltage2 POR 2.7 V Low-Voltage Warning Interrupt LVI_2p7 2.73 V Low-Voltage Alarm Interrupt LVI_2p2 2.23 V 1. During 3.3-volt VDD power supply ramp down 2. During 3.3-volt VDD power supply ramp up (gated by LVI_2p7) 10.3.3 Voltage and current operating behaviors Table 9. Voltage and current operating behaviors Symbol Description Min. Max. Unit Notes VOH Output high voltage — Normal drive pad (except RESET) • 2.7 V ≤ VDD ≤ 3.6 V, IOH = –5 mA VDD – 0.5 — V 1 VOH Output high voltage — High drive pad (except RESET) • 2.7 V ≤ VDD ≤ 3.6 V, IOH = –20 mA VDD – 0.5 — V 2, 1 IOHT Output high current total for all ports — 100 mA — VOL Output low voltage — Normal drive pad (except RESET) • 2.7 V ≤ VDD ≤ 3.6 V, IOL = 5 mA — 0.5 V 1 VOL Output low voltage — High drive pad (except RESET) • 2.7 V ≤ VDD ≤ 3.6 V, IOL = 20 mA — 0.5 V 2, 1 IOLT Output low current total for all ports — 100 mA — IIN Input leakage current (per pin) for full temperature range — 1 μA 3 IIN Input leakage current (per pin) at 25 °C — 0.025 μA 3 Table continues on the next page... General MC56F81xxx, Rev. 1.1, 12/2020 42 NXP Semiconductors |
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