MC56F81663 datasheet(67/73 Pages) NXP

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RXDPW

RXD

SCI receive

data pin

(Input)

Figure 20. RXD pulse width

TXDPW

TXD

SCI transmit

data pin

(output)

Figure 21. TXD pulse width

11.7.3 LPI2C

Table 37. LPI2C specifications

Symbol

Description

Min.

Max.

Unit

Notes

fSCL

SCL clock frequency

Standard mode (Sm)

100

kHz

1, 2, 3

Fast mode (Fm)

400

Fast mode Plus (Fm+)

1000

Ultra Fast mode (UFm)

5000

High speed mode (Hs-mode)

3400

1. Hs-mode is only supported in slave mode.

2. The maximum SCL clock frequency in Fast mode with maximum bus loading (400pF) can only be achieved with

appropriate pull-up devices on the bus when using the high or normal drive pins across the full voltage range . The

maximum SCL clock frequency in Fast mode Plus can support maximum bus loading (400pF) with appropriate pull-up

devices when using the high drive pins. The maximum SCL clock frequency in Ultra Fast mode can support maximum bus

loading (400pF) when using the high drive pins. The maximum SCL clock frequency for slave in High speed mode can

support maximum bus loading (400pF) with appropriate pull-up devices when using the high drive pins. For more

information on the required pull-up devices, see I2C Bus Specification.

3. See the section "General switching specifications".

Design Considerations

12.1 Thermal design considerations

An estimate of the chip junction temperature (TJ) can be obtained from the equation:

TJ = TA + (RΘJA × PD)

where

TA = Ambient temperature for the package (°C)

RΘJA = Junction-to-ambient thermal resistance (°C/W)

Design Considerations

MC56F81xxx, Rev. 1.1, 12/2020

NXP Semiconductors

MC56F81663 数据表(PDF) 67 Page - NXP Semiconductors

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