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ADC3908CSSS 数据表(PDF) 5 Page - Texas Instruments |
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ADC3908CSSS 数据表(HTML) 5 Page - Texas Instruments |
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5 / 131 page  5 Specifications 5.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) PARAMETER TEST CONDITIONS MIN MAX UNIT Supply voltage range 1.8 V, AVDD –0.3 2.1 V Supply voltage range 1.8 V to 3.3 V, IOVDD –0.3 3.6 Supply voltage range, GND, DGND –0.3 0.3 Voltage applied to input pins INAP/M, INBP/M, CLK, DCLKIN –0.3 2.1 VREF –0.3 2.1 RESET, SCLK, SEN, SDIO, OEN –0.3 2.1 Junction temperature, TJ 110 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 5.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 1000 V Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins(2) 500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 5.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage range Supply voltage range 1.8v AVDD(1) 1.7 1.8 1.9 V Supply voltage range IOVDD(1) 1.7 1.8 1.9 V Supply voltage range Supply voltage range 3.3v IOVDD(1) 3.2 3.3 3.4 V TA Operating free-air temperature –40 105 °C TJ Operating junction temperature 105(2) °C (1) Measured to GND. (2) Prolonged use above this junction temperature may increase the device failure-in-time (FIT) rate. 5.4 Thermal Information THERMAL METRIC(1) ADC39xx UNIT RSM (QFN) 32 Pins RΘJA Junction-to-ambient thermal resistance 38.1 °C/W RΘJC(top) Junction-to-case (top) thermal resistance 37.2 °C/W RΘJB Junction-to-board thermal resistance 17.9 °C/W ΨJT Junction-to-top characterization parameter 1 °C/W ΨJB Junction-to-board characterization parameter 17.9 °C/W www.ti.com ADC3910D125 SBASAD1 – DECEMBER 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: ADC3910D125 |
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