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数据搜索系统，热门电子元器件搜索 |
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ADC3908CSSS 数据表(PDF) 128 Page - Texas Instruments |
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ADC3908CSSS 数据表(HTML) 128 Page - Texas Instruments |
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128 / 131 page  www.ti.com PACKAGE OUTLINE C 32X 0.25 0.15 2.8 0.05 32X 0.45 0.25 1 MAX (0.2) TYP 0.05 0.00 28X 0.4 2X 2.8 2X 2.8 A 4.1 3.9 B 4.1 3.9 0.25 0.15 0.45 0.25 4X (0.45) (0.1) VQFN - 1 mm max height RSM0032B PLASTIC QUAD FLATPACK - NO LEAD 4219108/B 08/2019 PIN 1 INDEX AREA 0.08 C SEATING PLANE 1 8 17 24 9 16 32 25 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD DETAIL SEE TERMINAL SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. 33 SEE SIDE WALL DETAIL SIDE WALL DETAIL OPTIONAL METAL THICKNESS SCALE 3.000 DETAIL OPTIONAL TERMINAL TYPICAL |
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