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TMP86FS49AIUG 数据表(PDF) 290 Page - Toshiba Semiconductor |
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TMP86FS49AIUG 数据表(HTML) 290 Page - Toshiba Semiconductor |
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290 / 296 page  Page 274 22. Electrical Characteristics 22.6 Flash Characteristics TMP86FS49AIUG 22.8 Handling Precaution - The solderability test conditions for lead-free products (indicated by the suffix G in product name) are shown below. 1. When using the Sn-37Pb solder bath Solder bath temperature = 230 °C Dipping time = 5 seconds Number of times = once R-type flux used 2. When using the Sn-3.0Ag-0.5Cu solder bath Solder bath temperature = 245 °C Dipping time = 5 seconds Number of times = once R-type flux used Note: The pass criteron of the above test is as follows: Solderability rate until forming ≥ 95 % - When using the device (oscillator) in places exposed to high electric fields such as cathode-ray tubes, we recommend elec- trically shielding the package in order to maintain normal operating condition. |
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