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MSC8103/D 数据表(PDF) 42 Page - Freescale Semiconductor, Inc |
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MSC8103/D 数据表(HTML) 42 Page - Freescale Semiconductor, Inc |
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42 / 104 page  MSC8103 Network Digital Signal Processor, Rev. 11 2-2 Freescale Semiconductor Physical and Electrical Specifications 2.2 Recommended Operating Conditions Table 2-2 lists recommended operating conditions. Proper device operation outside of these conditions is not guaranteed. 2.3 Thermal Characteristics Table 2-3 describes thermal characteristics of the MSC8103. See Section 4.1, Thermal Design Considerations, on page 4-1 for details on these characteristics. Table 2-2. Recommended Operating Conditions Rating Symbol Value Unit SC140 core supply voltage VDD 275 MHz: 1.5 to 1.7 300 MHz: 1.55 to 1.7 V V PLL supply voltage VCCSYN 275 MHz: 1.5 to 1.7 300 MHz: 1.55 to 1.7 V V I/O supply voltage VDDH 3.135 to 3.465 V Input voltage VIN –0.2 to VDDH + 0.2 V Operating temperature range TJ 275 MHz: –40 to 105 300 MHz: –40 to 75 °C °C Table 2-3. Thermal Characteristics Characteristic Symbol Lidded FC-PBGA 17 × 17 mm Unit Natural Convection 200 ft/min (1 m/s) airflow Junction-to-ambient, single-layer board1, 2 RθJA or θJA 50 37 °C/W Junction-to-ambient, four-layer board1, 3 RθJA or θJA 22 18 °C/W Junction-to-board3 RθJB or θJB 15 °C/W Junction-to-case4 RθJC or θJC 0.8 °C/W Notes: 1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 2. Per SEMI G38-87 and EIA/JESD51-2 with the single layer board horizontal. 3. Per JEDEC JESD51-6 with the board (JESD51-9) horizontal. 4. Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on the top surface of the board near the package. 5. Thermal resistance between the die and the case top surface without thermal grease. TBD = to be determined. If a thin (less than 50 micron) thermal grease interface is established to a heat sink from the lid, the junction to sink thermal resistance is about 0.7 °C/W. |
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