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LPC802 数据表(PDF) 65 Page - NXP Semiconductors |
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LPC802 数据表(HTML) 65 Page - NXP Semiconductors |
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65 / 83 page ![]() LPC802 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2018. All rights reserved. Product data sheet Rev. 1.6 — 27 April 2018 65 of 83 NXP Semiconductors LPC802 32-bit ARM Cortex-M0+ microcontroller (1) Position the decoupling capacitors of 0.1 μF and 0.01 μF as close as possible to the VDD pin. Add one set of decoupling capacitors to each VDD pin. (2) Position the decoupling capacitors of 0.1 μF as close as possible to the VREFN and VDD pins. The 10 μF bypass capacitor filters the power line. Tie VREFP to VDD if the ADC is not used. Tie VREFN to VSS if ADC is not used. (3) Uses the ARM 10-pin interface for SWD. (4) When measuring signals of low frequency, use a low-pass filter to remove noise and to improve ADC performance. Also see Ref. 4. (5) External pull-up resistors on SWDIO and SWCLK pins are optional because these pins have an internal pull-up enabled by default. Fig 34. Power, clock, and debug connections PIO0_12 ADC_0 VDD VREFP PIO0_7/ADC_1/ACMPVREF LPC802 3.3 V (4) (ADC_1), (2) (ACMPVREF) GND (1) (4) (2) 0.01 μF 0.1 μF 3.3 V GND GND 10 μF 0.1 μF 0.1 μF ISP select pin aaa-026823 SWDIO/PIO0_2 SWCLK/PIO0_3 RESETN/PIO0_5 VSS 3.3 V GND GND 1 3 5 7 9 2 4 6 8 10 n.c. n.c. n.c. SWD connector (5) (4) (5) 3.3 V ~10 kΩ - 100 kΩ ~10 kΩ - 100 kΩ 3.3 V |
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