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LPC802 数据表(PDF) 69 Page - NXP Semiconductors |
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LPC802 数据表(HTML) 69 Page - NXP Semiconductors |
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69 / 83 page ![]() LPC802 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2018. All rights reserved. Product data sheet Rev. 1.6 — 27 April 2018 69 of 83 NXP Semiconductors LPC802 32-bit ARM Cortex-M0+ microcontroller Fig 36. Package outline SOT (TSSOP16) UNIT A1 A2 A3 bp cD (1) E (2) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.40 0.06 8 0 o o 0.13 0.1 0.2 1 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT403-1 MO-153 99-12-27 03-02-18 w M b p D Z e 0.25 18 16 9 θ A A1 A2 L p Q detail X L (A ) 3 HE E c v M A X A y 0 2.5 5 mm scale TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 A max. 1.1 pin 1 index |
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