EM6812F2TP24B datasheet(81/81 Pages) EMMICRO

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EM6812

www.emmicroelectronic.com

18 Ordering information Flash device

Packaged Device:

Device in DIE Form:

EM6812

Flash Memory Size:

F2 = 2k x 22 Bit (5.6 kByte)

F4 = 4k x 22 Bit (11.2 kByte)

F8 = 8k x 22 Bit (22.5 kByte)

Package:

Die form:

SO24 = 24 pin SOIC

WW = Wafer

TP24 = 24 pin TSSOP

WS = Sawn Wafer/Frame

WP = Waffle Pack

Delivery Form:

Thickness:

A = Stick

11 = 11 mils (280um), by default

B = Tape&Reel

27 = 27 mils (686um), not backlapped

F8 WS 11

TP24 A

In its packaged form, EM6812 is available in green mold / leadfree (symbolized by a “+” at the end of the part number).

Note:

Please contact EM Microelectronic for availability of other die thicknesses.

Ordering Part Number (selected examples)

Part Number

Memory Size

Package/Die Form

Delivery Form/Thickness

EM6812F2TP24B+

2k x 22 bit Flash

24 pin TSSOP

Tape&Reel, 3000 pieces

EM6812F4TP24A+

4k x 22 bit Flash

24 pin TSSOP

Stick, 50 pieces

EM6812F8SO24B+

8k x 22 bit Flash

24 pin SOIC

Tape&Reel, 2000 pieces

EM6812F8WS11

8k x 22 bit Flash

Sawn wafer

11 mils

Please make sure to give the complete Part Number when ordering.

Package Marking

SOIC marking:

TSSOP marking:

First line:

E M 6 8 1 2

% % % Y

E M 6

2 % %

Second line:

P P P P P P P P P P P

P P P P P P P P

Third line:

F & D

Y P

Where: %%% = specific number assigned by EM

Y = Year of assembly

PP…P = Production identification (date & lot number) of EM Microelectronic

& = memory size (2,4, 8 k Instruction)

EM Microelectronic-Marin SA (EM) makes no warranty for the use of its products, other than those expressly contained in

the Company's standard warranty which is detailed in EM's General Terms of Sale located on the Company's web site.

EM assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or

specifications detailed herein at any time without notice, and does not make any commitment to update the information

contained herein. No licenses to patents or other intellectual property of EM are granted in connection with the sale of EM

products, expressly or by implications. EM's products are not authorized for use as components in life support devices or

systems.

EM Microelectronic-Marin SA, 05/05, Rev. E

EM6812F2TP24B 数据表(PDF) 81 Page - EM Microelectronic - MARIN SA

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