EDBA164B4PR-1DITF-R datasheet(79/152 Pages) MICRON

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Table 51: Temperature Sensor Definitions and Operating Conditions

Parameter

Description

Symbol

Min/Max

Value

Unit

System temperature

gradient

Maximum temperature gradient experi-

enced by the memory device at the temper-

ature of interest over a range of 2˚C

TempGradient

MAX

System-dependent

˚C/s

MR4 READ interval

Time period between MR4 READs from the

system

ReadInterval

MAX

System-dependent

Temperature sensor

interval

Maximum delay between internal updates

of MR4

tTSI

MAX

System response

delay

Maximum response time from an MR4 READ

to the system response

SysRespDelay

MAX

System-dependent

Device temperature

margin

Margin above maximum temperature to

support controller response

TempMargin

MAX

˚C

The mobile LPDDR2 device accommodates the temperature margin between the point

at which the device temperature enters the extended temperature range and the point

at which the controller reconfigures the system accordingly. To determine the required

MR4 polling frequency, the system must use the maximum TempGradient and the max-

imum response time of the system according to the following equation:

TempGradient × (ReadInterval + tTSI + SysRespDelay) ≤ 2°C

For example, if TempGradient is 10˚C/s and the SysRespDelay is 1ms:

10°C

× (ReadInterval + 32ms + 1ms) ≤ 2°C

In this case, ReadInterval must not exceed 167ms.

216-Ball and 220-Ball, Dual-Channel LPDDR2 SDRAM

MODE REGISTER READ

09005aef85eb530a

216b_220b_2ch_2e0e_embedded_lpddr2.pdf – Rev. F 08 /16 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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