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EDBA164B4PR-1DITF-R 数据表(PDF) 128 Page - Micron Technology

部件名 EDBA164B4PR-1DITF-R
功能描述  216-Ball and 220-Ball, Dual-Channel LPDDR2 SDRAM Features
PDF  152 Pages
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制造商  MICRON [Micron Technology]
网页  http://www.micron.com
标志 MICRON - Micron Technology

EDBA164B4PR-1DITF-R 数据表(HTML) 128 Page - Micron Technology

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Table 88: Definitions and Calculations (Continued)
Symbol
Description
Calculation
Notes
tJIT(duty)
Defined with absolute and average specifications
for tCH and tCL, respectively.
tJIT(duty),min =
MIN((tCH(abs),min – tCH(avg),min),
(tCL(abs),min – tCL(avg),min)) × tCK(avg)
tJIT(duty),max =
MAX((tCH(abs),max – tCH(avg),max),
(tCL(abs),max – tCL(avg),max)) × tCK(avg)
Notes:
1. Not subject to production testing.
2. Using these equations, tERR(nper) tables can be generated for each tJIT(per),act value.
tCK(abs), tCH(abs), and tCL(abs)
These parameters are specified with their average values; however, the relationship be-
tween the average timing and the absolute instantaneous timing (defined in the follow-
ing table) is applicable at all times.
Table 89: tCK(abs), tCH(abs), and tCL(abs) Definitions
Parameter
Symbol
Minimum
Unit
Absolute clock period
tCK(abs)
tCK(avg),min + tJIT(per),min
ps1
Absolute clock HIGH pulse width
tCH(abs)
tCH(avg),min + tJIT(duty),min2/tCK(avg)min
tCK(avg)
Absolute clock LOW pulse width
tCL(abs)
tCL(avg),min + tJIT(duty),min2/tCK(avg)min
tCK(avg)
Notes:
1. tCK(avg),min is expressed in ps for this table.
2. tJIT(duty),min is a negative value.
Clock Period Jitter
The LPDDR2 device can tolerate some clock period jitter without core timing parameter
derating. This section describes device timing requirements with clock period jitter
(tJIT(per)) in excess of the values found in the AC Timing section. Calculating cycle time
derating and clock cycle derating are also described.
Clock Period Jitter Effects on Core Timing Parameters
Core timing parameters (tRCD, tRP, tRTP, tWR, tWRA, tWTR, tRC, tRAS, tRRD, tFAW) ex-
tend across multiple clock cycles. Clock period jitter impacts these parameters when
measured in numbers of clock cycles. Within the specification limits, the device is char-
acterized and verified to support tnPARAM = RU[tPARAM/tCK(avg)]. During device op-
eration where clock jitter is outside specification limits, the number of clocks or
tCK(avg), may need to be increased based on the values for each core timing parameter.
216-Ball and 220-Ball, Dual-Channel LPDDR2 SDRAM
Clock Period Jitter
09005aef85eb530a
216b_220b_2ch_2e0e_embedded_lpddr2.pdf – Rev. F 08 /16 EN
128
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.



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