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TDA4VEN...Q1 数据表(PDF) 222 Page - Texas Instruments |
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TDA4VEN...Q1 数据表(HTML) 222 Page - Texas Instruments |
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222 / 236 page  8.2.5 High Speed Differential Signal Routing Guidance The High Speed Interface Layout Guidelines provides guidance for successful routing of the high speed differential signals. This includes PCB stackup and materials guidance as well as routing skew, length and spacing limits. TI supports only designs that follow the board design guidelines contained in the application note. 8.2.6 Thermal Solution Guidance The Thermal Design Guide for DSP and ARM Application Processors provides guidance for successful implementation of a thermal solution for system designs containing this device. This document provides background information on common terms and methods related to thermal solutions. TI only supports designs that follow system design guidelines contained in the application note. TDA4VEN-Q1, TDA4AEN-Q1 SPRSP96A – MARCH 2024 – REVISED SEPTEMBER 2024 www.ti.com 222 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: TDA4VEN-Q1 TDA4AEN-Q1 |
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