| 数据搜索系统,热门电子元器件搜索 |
|
ADV7341 数据表(PDF) 21 Page - Analog Devices |
|
|
|||||||||||||||||||||||||||||
ADV7341 数据表(HTML) 21 Page - Analog Devices |
|
21 / 108 page ![]() Data Sheet ADV7340/ADV7341 Rev. C | Page 21 of 108 ABSOLUTE MAXIMUM RATINGS Table 13. Parameter1 Rating VAA to AGND −0.3 V to +3.9 V VDD to DGND −0.3 V to +2.3 V PVDD to PGND −0.3 V to +2.3 V VDD_IO to GND_IO −0.3 V to +3.9 V AGND to DGND −0.3 V to +0.3 V AGND to PGND −0.3 V to +0.3 V AGND to GND_IO −0.3 V to +0.3 V DGND to PGND −0.3 V to +0.3 V DGND to GND_IO −0.3 V to +0.3 V PGND to GND_IO −0.3 V to +0.3 V Digital Input Voltage to GND_IO −0.3 V to VDD_IO + 0.3 V Analog Outputs to AGND −0.3 V to VAA Maximum CLKIN Input Frequency 80 MHz Storage Temperature Range (TS) −65°C to +150°C Junction Temperature (TJ) 150°C Lead Temperature (Soldering, 10 sec) 260°C 1 Analog output short circuit to any power supply or common can be of an indefinite duration. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The ADV7340/ADV7341 are high performance integrated circuits with an ESD rating of <1 kV, and they are ESD sensitive. Proper precautions should be taken for handling and assembly. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 14. Thermal Resistance1 Package Type θJA θJC Unit 64-Lead LQFP 47 11 °C/W 1 Values are based on a JEDEC 4-layer test board. The ADV7340/ADV7341 are RoHS-compliant, Pb-free products. The lead finish is 100% pure Sn electroplate. The devices are suitable for Pb-free applications up to 255°C (±5°C) IR reflow (JEDEC STD-20). Each part is backward compatible with conventional SnPb soldering processes. The electroplated Sn coating can be soldered with Sn/Pb solder paste at conventional reflow temperatures of 220°C to 235°C. ESD CAUTION |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |