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LTM4686BIVPBF 数据表(PDF) 3 Page - Analog Devices |
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LTM4686BIVPBF 数据表(HTML) 3 Page - Analog Devices |
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3 / 130 page  LTM4686B 3 Rev. 0 For more information www.analog.com PIN CONFIGURATION ABSOLUTE MAXIMUM RATINGS Terminal Voltages VINn (Note 4), SVIN....................................... –0.3V to 6V VOUTn ........................................................... –0.3V to 6V VOSNS0+, VORB0+, VOSNS1, VORB1, INTVCC .... –0.3V to 6V RUNn, SDA, SCL, ALERT........................... –0.3V to 5.5V FSWPHCFG, VOUTnCFG, VTRIMnCFG, ASEL .. –0.3V to 2.75V VDD33, GPIOn, SYNC, SHARE_CLK, WP, COMPna, VOSNS0–, VORB0–................... –0.3V to 3.6V SGND........................................................ –0.3V to 0.3V Temperatures Internal Operating Temperature Range (Notes 2, 3)........................................ –40°C to 125°C Storage Temperature Range .................. –55°C to 125°C Peak Solder Reflow Package Body Temperature...260°C (Note 1) 1 2 3 4 5 6 7 TOP VIEW 8 9 M L K J H G F E D C B A VOUT0 VOUT0 FSWPHCFG GPIO0 GPIO1 VIN0 VIN0 GND GND GND SW0 GND TSNS0 TSNS0 RUN0 ALERT GND COMP0b VOSNS0+ VORB0– SVIN VORB0+ VOSNS0– COMP0a SYNC SDA SCL RUN1 SGND INTVCC GND GND GND ASEL VOUT0CFG VTRIM0CFG VTRIM1CFG SHARE_CLK COMP1a VOSNS1 VOUT1CFG GND GND GND VOUT1 TSNS0a TSNS0b WP SW1 VDD25 VDD33 COMP1b VORB1 VOUT1 VIN1 VIN1 LGA PACKAGE 108-LEAD (16mm × 11.9mm × 1.82mm) TJMAX = 125°C, θJA = 9.7°C/W, θJCtop = 5.5°C/W, θJCbot = 3.1°C/W WEIGHT = 1.1 GRAMS NOTES: 1) θ VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS. 2) θJA VALUE IS OBTAINED WITH DEMO BOARD. 3) REFER TO APPLICATION INFORMATION SECTION FOR LAB MEASUREMENT AND DERATING INFORMATION. ORDER INFORMATION PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE TYPE MSL RATING TEMPERATURE RANGE (SEE NOTE 2) DEVICE FINISH CODE LTM4686BEV#PBF Au (RoHS) LTM4686BV e4 LGA 4 –40°C to 125°C LTM4686BIV#PBF Au (RoHS) LTM4686BV e4 LGA 4 –40°C to 125°C • Contact the factory for parts specified with wider operating temperature ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. • Device temperature grade is indicated by a label on the shipping container. • Recommended LGA and BGA PCB Assembly and Manufacturing Procedures • LGA and BGA Package and Tray Drawings |
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