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TDA4VEN...Q1 数据表(PDF) 210 Page - Texas Instruments |
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TDA4VEN...Q1 数据表(HTML) 210 Page - Texas Instruments |
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210 / 236 page ![]() Table 6-125. OSPI0 Switching Characteristics – Tap DDR Mode see Figure 6-107 NO. PARAMETER MODE MIN MAX UNIT O1 tc(CLK) Cycle time, OSPI0_CLK 40 ns O2 tw(CLKL) Pulse duration, OSPI0_CLK low ((0.475P(1)) - 0.3) ns O3 tw(CLKH) Pulse duration, OSPI0_CLK high ((0.475P(1)) - 0.3) ns O4 td(CSn-CLK) Delay time, OSPI0_CSn[3:0] active edge to OSPI0_CLK rising edge ((0.475P(1)) + ((0.975M(2)R(5)) - 1) ((0.525P(1)) + ( 1.025M(2)R(5)) + 1) ns O5 td(CLK-CSn) Delay time, OSPI0_CLK rising edge to OSPI0_CSn[3:0] inactive edge ((0.475P(1)) + (0.975N(3)R(5)) - 1) ((0.525P(1)) + (1.025N(3)R(5)) + 1) ns O6 td(CLK-D) Delay time, OSPI0_CLK active edge to OSPI0_D[7:0] transition (- 5.04 + (0.975(T(4) + 1)R(5)) - (0.525P(1))) (3.64 + (1.025(T(4) + 1)R(5)) - (0.475P(1))) ns (1) P = SCLK cycle time in ns = OSPI0_CLK cycle time in ns (2) M = OSPI_DEV_DELAY_REG[D_INIT_FLD] (3) N = OSPI_DEV_DELAY_REG[D_AFTER_FLD] (4) T = OSPI_RD_DATA_CAPTURE_REG[DDR_READ_DELAY_FLD] (5) R = reference clock cycle time in ns OSPI_CLK OSPI_TIMING_01 OSPI_CSn O6 O3 O2 O1 O5 OSPI_D[i:0] O6 O4 Figure 6-107. OSPI0 Switching Characteristics – Tap DDR, No Loopback 6.9.5.20 PCIe The PCI-Express Subsystem is compliant with the PCIe® Base Specification, Revision 4.0. Refer to the specification for timing details. For more details about features and additional description information on the device Peripheral Component Interconnect Express (PCIe), see the SERDES0 Signal Descriptions and the corresponding subsection within Detailed Description. For more information, see Peripheral Component Interconnect Express (PCIe) Subsystem section in Peripherals chapter of the device TRM. TDA4VEN-Q1, TDA4AEN-Q1 SPRSP96A – MARCH 2024 – REVISED SEPTEMBER 2024 www.ti.com 210 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: TDA4VEN-Q1 TDA4AEN-Q1 |
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