AD9520-5SLASHPCBZ datasheet(55/80 Pages) AD

55 / 80 page

AD9520-5

Rev. 0 | Page 55 of 80

THERMAL PERFORMANCE

Table 43. Thermal Parameters for 64-Lead LFCSP

Symbol

Thermal Characteristic Using a JEDEC JESD51-7 Plus JEDEC JESD51-5 2S2P Test Board

Value (°C/W)

θJA

Junction-to-ambient thermal resistance, 0.0 m/sec airflow per JEDEC JESD51-2 (still air)

22.0

θJMA

Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)

19.2

θJMA

Junction-to-ambient thermal resistance, 2.0 m/sec airflow per JEDEC JESD51-6 (moving air)

17.2

ΨJB

Junction-to-board characterization parameter, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)

and JEDEC JESD51-8

11.6

θJC

Junction-to-case thermal resistance (die-to-heat sink) per MIL-Std 883, Method 1012.1

1.3

ΨJT

Junction-to-top-of-package characterization parameter, 0 m/sec airflow per JEDEC JESD51-2 (still air)

0.1

The AD9520 is specified for a case temperature (TCASE). To ensure

that TCASE is not exceeded, an airflow source can be used.

Use the following equation to determine the junction

temperature on the application PCB:

TJ = TCASE + (ΨJT × PD)

where:

TJ is the junction temperature (°C).

TCASE is the case temperature (°C) measured by the user at the

top center of the package.

ΨJT is the value from Table 43.

PD is the power dissipation (see the total power dissipation in

Table 15.)

Values of θJA are provided for package comparison and PCB

design considerations. θJA can be used for a first-order

approximation of TJ by the equation

TJ = TA + (θJA × PD)

where TA is the ambient temperature (°C).

Values of θJC are provided for package comparison and PCB

design considerations when an external heat sink is required.

Values of ΨJB are provided for package comparison and PCB

design considerations.

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