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JS28F256P33BFE 数据表(PDF) 14 Page - Micron Technology |
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JS28F256P33BFE 数据表(HTML) 14 Page - Micron Technology |
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14 / 90 page  P33-65nm Datasheet Aug 2009 14 Order Number: 320003-08 4.1 Dual-Die Configurations Note: Amax = VIH selects the Top parameter Die; Amax = VIL selects the Bottom Parameter Die. RFU — RESERVED FOR FUTURE USE: Reserved by Numonyx for future device functionality and enhancement. These should be treated in the same way as a Don’t Use (DU) signal. DU — DON’T USE: Do not connect to any other signal, or power supply; must be left floating. NC — NO CONNECT: No internal connection; can be driven or floated. Table 4: TSOP and Easy BGA Signal Descriptions (Sheet 2 of 2) Symbol Type Name and Function Figure 6: 512-Mbit Easy BGA Block Diagram Top Param Die (256-Mbit) Bottom Param Die (256-Mbit) WP# CLK CE# ADV# OE# WAIT WE# RST# VCC VPP DQ[15:0] A[MAX:1] VCCQ VSS Easy BGA 512-Mbit (Dual-Die) Configuration |
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