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TUSB7340 数据表(PDF) 32 Page - Texas Instruments

部件名 TUSB7340
功能描述  TUSB73x0 USB 3.0 xHCI Host Controller
PDF  122 Pages
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制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments

TUSB7340 数据表(HTML) 32 Page - Texas Instruments

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7.3.1.2 Power-Down Sequence
1. Assert PERST# to the device.
2. Remove the reference clock.
3. Remove the 3.3-V and 1.1-V voltages
See the power power-down sequencing diagram in Figure 7-17. If the VDD33_AUX terminal is to remain
powered after a system shutdown, then the host controller power-down sequence is exactly the same as shown
in Figure 7-17.
VDD11
VDDA_3P3
and VDD33
PCIE_REFCLK
PERST#
Figure 7-17. Power-Down Sequence
7.3.2 PCI Express Power Management
The TUSB73X0 includes the MSI-X Table and PBA in memory mapped register space (see Table 8-195). These
registers are accessible through the address programmed into the Base Address Register 2/3.
7.4 Layout
7.4.1 Layout Guidelines
7.4.1.1 High-Speed Differential Routing
The high-speed differential pair (USB_DM and USB_DP) is connected to a type A USB connecter. The
differential pair traces should be routed with 90 Ω ±15% differential impedance. The high-speed signal pair
should be trace length matched. Maximum trace length mismatch between high speed USB signal pairs should
be no greater than 150 mils. Keep total trace length to a minimum, if routing longer than six inches contact TI to
address signal integrity concerns. Route differential traces first.
Route the differential pairs on the top or bottom layers with the minimum amount of vias possible. No termination
or coupling caps are required. If a common mode choke is required then place the choke as close as possible
to the USB connector signal pins. Likewise ESD clamps should also be placed as close as possible to the USB
connector signal pins (closer than the choke).
For more detailed information, you may also see the USB 2.0 Board Design and Layout Guidelines which
describes general PCB design and layout guidelines for the USB 2.0 differential pair (DP/DM).
7.4.1.2 SuperSpeed Differential Routing
SuperSpeed consists of two differential routing pairs, a transmit pair (USB_SSTXM and USB_SSTXP) and a
receive pair (USB_SSRXM and USB_SSRXP). Each differential pair traces should be routed with 90 Ω ±15%
differential impedance. The high-speed signal pair should be trace length matched. Maximum trace length
mismatch between SuperSpeed USB signal pairs should be no greater than 5 mils. The total length for each
differential pair can be no longer than six inches, this is based on the SS USB compliance channel specification,
and should be avoided if at all possible. TI recommends that the SuperSpeed differential pairs be as short as
possible.
The transmit differential pair does not have to be the same length as the receive differential pair. Keep total trace
length to a minimum. Route differential traces first. Route the differential pairs on the top or bottom layers with
the minimum amount of vias possible. The transmitter differential pair requires 0.1-μF coupling capacitors for
TUSB7320, TUSB7340
SLLSE76Q – MARCH 2011 – REVISED MARCH 2024
www.ti.com
32
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Copyright © 2024 Texas Instruments Incorporated
Product Folder Links: TUSB7320 TUSB7340



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